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https://hdl.handle.net/10356/5086
Title: | Study on copper electromigration reliability of the ULSI devices | Authors: | Low, Joon Kiat. | Keywords: | DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects | Issue Date: | 2003 | Abstract: | This project studies copper electromigration reliability with the help of engineers of Chartered Semiconductor Mfg. Ltd. As the processing of the copper metallization can greatly affect its reliability, experiments will be conducted to determine how some of the processing conditions and environments can affect the performance of copper. | URI: | http://hdl.handle.net/10356/5086 | Schools: | School of Materials Science & Engineering | Rights: | Nanyang Technological University | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
Appears in Collections: | MSE Theses |
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MSE-THESES_49.pdf Restricted Access | 6.89 MB | Adobe PDF | View/Open |
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