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|Title:||Organic light emitting diode||Authors:||Koh, Wei Chong.||Keywords:||DRNTU::Engineering::Electrical and electronic engineering::Optics, optoelectronics, photonics||Issue Date:||2012||Abstract:||The OLED suffers from poor storage and operation lifetime because of the growth and propagation of non-emissive regions in the cathode-organic materials interface. The encapsulation is required to suppress the dark spots growth. The OLED in NTU is still in its infant stage. The OLED has decent performance but device stability is still a challenging block to solve as the device is prone to black spot invasion. Therefore, a pilot research in encapsulation study is required to fill up the knowledge gap in understanding the correlation between OLED performance and the effects of dark spots growth and cathode delamination. This is the FYP work. The primary objective of this FYP is to conduct a study on the commercially successful encapsulation techniques and replicating it in the lab. The methods used to conduct this FYP is first to conduct a wide and in depth literature review of the reported glass encapsulation and thin film encapsulation methods in the journals. Then a practical approach on the encapsulation work and characterization are conducted to emulate and validate the observations. The final step is to report on the observations and make recommendations for future work. The results from the experiment showed that the glass encapsulation is still not adequate in suppressing the growth of dark spots. The contributing factors are the lack of proper encapsulation materials and in depth knowledge of degradation mechanisms at the cathode - organic materials interface. It is therefore recommended to research more in depth study of the degradation mechanisms and to acquire proper encapsulation materials in order to make further progression in lab encapsulation. Also, a different approach to suppress the dark spots growth and cathode delamination can be looked into.||URI:||http://hdl.handle.net/10356/50981||Rights:||Nanyang Technological University||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||EEE Student Reports (FYP/IA/PA/PI)|
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