Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5103
Title: Role of dopants on the properties of gold bonding wire
Authors: Saraswati.
Keywords: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Issue Date: 2004
Abstract: Gold bonding wire is a widely used electrically conducting interconnection in microelectronics industry, due to its good combination of inertness and low resistivity. The increasing miniaturization of electronics required the reduction in the pitch of the input/output inter-connections, and consequently made it necessary to reduce the wire diameter, while maintaining, or even increasing its performance.
URI: http://hdl.handle.net/10356/5103
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MSE Theses

Files in This Item:
File Description SizeFormat 
MSE-THESES_64.pdf
  Restricted Access
9.64 MBAdobe PDFView/Open

Page view(s) 50

284
Updated on Nov 27, 2020

Download(s) 10

5
Updated on Nov 27, 2020

Google ScholarTM

Check

Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.