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Title: Role of dopants on the properties of gold bonding wire
Authors: Saraswati.
Keywords: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
Issue Date: 2004
Abstract: Gold bonding wire is a widely used electrically conducting interconnection in microelectronics industry, due to its good combination of inertness and low resistivity. The increasing miniaturization of electronics required the reduction in the pitch of the input/output inter-connections, and consequently made it necessary to reduce the wire diameter, while maintaining, or even increasing its performance.
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MSE Theses

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