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|Title:||Role of dopants on the properties of gold bonding wire||Authors:||Saraswati.||Keywords:||DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects||Issue Date:||2004||Abstract:||Gold bonding wire is a widely used electrically conducting interconnection in microelectronics industry, due to its good combination of inertness and low resistivity. The increasing miniaturization of electronics required the reduction in the pitch of the input/output inter-connections, and consequently made it necessary to reduce the wire diameter, while maintaining, or even increasing its performance.||URI:||http://hdl.handle.net/10356/5103||Rights:||Nanyang Technological University||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||MSE Theses|
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