Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/51030
Title: Finite element simulation of laser shock forming
Authors: Soh, Kian Ann.
Keywords: DRNTU::Engineering::Manufacturing::CAD/CAM systems
Issue Date: 2012
Abstract: This project studies the feasibility of applying finite element analysis (FEA) to simulate high strain rate forming of thin copper foil during the Laser Shock Forming (LSF) process, thereby predicting their ultimate deformation. ABAQUS, a commercial finite element software, was used in this study. This report traces the development process of the finite element modelling, which includes the theoretical research, the development of the simulation model, and the verification of the simulation result by means of comparing with results from literature. To simulate the plastic deformation of copper using finite element model (FEM), a modified Fabbro Model was employed to model the shock pressure generated. Johnson –Cook model was used to simulate the material’s flow stress behaviour while Johnson-Cook Failure criterion was used to predict the damage initiation and evolution criteria in the simulation. Mooney-Rivlin model was used to describe the nonlinear hyper-elastic and incompressible behaviour of the flexible rubber pad. Suitable meshed model of the thin foil and pad were created and together with the material parameters, the plastic deformation of the copper thin foil was simulated. During the course of investigation and study, it was found that the increment time of 0.01 ns was suitable for the analysis. Mesh size of at least 0.0005 mm was recommended in this report in order to have accurate results. Suitable amplitude profile was selected in the analysis to ensure that the simulation created in this project is accurate, robust and conservative for real-time utilisation.
URI: http://hdl.handle.net/10356/51030
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)

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