Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/51060
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dc.contributor.authorArvin Eka Nata.
dc.date.accessioned2013-01-03T04:25:32Z
dc.date.available2013-01-03T04:25:32Z
dc.date.copyright2012en_US
dc.date.issued2012
dc.identifier.urihttp://hdl.handle.net/10356/51060
dc.description.abstractThis project study the relationship of thermal, mechanical and electrical properties relationship on the TSV, one of the method to do interconnection on 3D IC. 3D IC is an emerging technology and has the potential to be the solution to 2D IC limitation.en_US
dc.format.extent19 p.en_US
dc.language.isoenen_US
dc.rightsNanyang Technological University
dc.subjectDRNTU::Engineering::Electrical and electronic engineering::Integrated circuitsen_US
dc.titleThermal – Mechanical – Electrical relationship modeling on TSVen_US
dc.typeFinal Year Project (FYP)en_US
dc.contributor.supervisorChang Chip Hongen_US
dc.contributor.schoolSchool of Electrical and Electronic Engineeringen_US
dc.description.degreeBachelor of Engineeringen_US
item.grantfulltextrestricted-
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Appears in Collections:EEE Student Reports (FYP/IA/PA/PI)
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