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Title: Thermal – Mechanical – Electrical relationship modeling on TSV
Authors: Arvin Eka Nata.
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits
Issue Date: 2012
Abstract: This project study the relationship of thermal, mechanical and electrical properties relationship on the TSV, one of the method to do interconnection on 3D IC. 3D IC is an emerging technology and has the potential to be the solution to 2D IC limitation.
Schools: School of Electrical and Electronic Engineering 
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Student Reports (FYP/IA/PA/PI)

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