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https://hdl.handle.net/10356/5119| Title: | Effects of interfacial reactions and electromigration on the Cu/electroless Ni-P/Sn-3.5Ag solder joint strength | Authors: | Aditya Kumar | Keywords: | DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects | Issue Date: | 2007 | Source: | Aditya, K. (2007). Effects of interfacial reactions and electromigration on the Cu/electroless Ni-P/Sn-3.5Ag solder joint strength. Doctoral thesis, Nanyang Technological University, Singapore. | Abstract: | In this work, the effects of interfacial reactions and electromigration on the mechanical behavior of Cu/electroless Ni-P/Sn-3.5Ag solder joint were investigated. For a complete understanding, several process and material parameters, such as aging temperature, aging duration, Ni-P thickness, P concentration of Ni-P, and electric current density were varied systematically and their effect was studied on the solder joint strength. | URI: | https://hdl.handle.net/10356/5119 | DOI: | 10.32657/10356/5119 | Schools: | School of Materials Science & Engineering | Rights: | Nanyang Technological University | Fulltext Permission: | open | Fulltext Availability: | With Fulltext |
| Appears in Collections: | MSE Theses |
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| File | Description | Size | Format | |
|---|---|---|---|---|
| MSE-THESES_79.pdf | 19.41 MB | Adobe PDF |  View/Open |
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