Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5119
Full metadata record
DC FieldValueLanguage
dc.contributor.authorAditya Kumaren
dc.date.accessioned2008-09-17T10:20:28Zen
dc.date.available2008-09-17T10:20:28Zen
dc.date.copyright2007en
dc.date.issued2007en
dc.identifier.citationAditya, K. (2007). Effects of interfacial reactions and electromigration on the Cu/electroless Ni-P/Sn-3.5Ag solder joint strength. Doctoral thesis, Nanyang Technological University, Singapore.en
dc.identifier.urihttps://hdl.handle.net/10356/5119en
dc.description.abstractIn this work, the effects of interfacial reactions and electromigration on the mechanical behavior of Cu/electroless Ni-P/Sn-3.5Ag solder joint were investigated. For a complete understanding, several process and material parameters, such as aging temperature, aging duration, Ni-P thickness, P concentration of Ni-P, and electric current density were varied systematically and their effect was studied on the solder joint strength.en
dc.format.extent220 p.en
dc.rightsNanyang Technological Universityen
dc.subjectDRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnectsen
dc.titleEffects of interfacial reactions and electromigration on the Cu/electroless Ni-P/Sn-3.5Ag solder joint strengthen
dc.typeThesisen
dc.contributor.supervisorV. Kripeshen
dc.contributor.supervisorChen Zhongen
dc.contributor.schoolSchool of Materials Science & Engineeringen
dc.description.degreeDOCTOR OF PHILOSOPHY (SME)en
dc.identifier.doi10.32657/10356/5119en
item.grantfulltextopen-
item.fulltextWith Fulltext-
Appears in Collections:MSE Theses
Files in This Item:
File Description SizeFormat 
MSE-THESES_79.pdf19.41 MBAdobe PDFThumbnail
View/Open

Page view(s) 20

840
Updated on Apr 28, 2025

Download(s) 20

388
Updated on Apr 28, 2025

Google ScholarTM

Check

Altmetric


Plumx

Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.