Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5126
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dc.contributor.authorWang, Lei.en_US
dc.date.accessioned2008-09-17T10:20:41Z-
dc.date.available2008-09-17T10:20:41Z-
dc.date.copyright2006en_US
dc.date.issued2006-
dc.identifier.urihttp://hdl.handle.net/10356/5126-
dc.description.abstractAnodic wafer bonding technology is an important process for fabrication and packaging of Micro-Electro-Mechanical Systems (MEMS). This study concentrates on the anodic bonding process at lower t emperatures, which is more desirable for MEMS fabrication. A model of the electrostatic force was developed to investigate the relationships of the force and process parameters. The electrostatic force established during bonding becomes critical when the temperature variation is restricted. Modeling analysis showed that the magnitude of the electrostatic force was dependent on temperature and voltage, and the topology of the wafer surface does not significantly change its magnitude.en_US
dc.format.extent239 p.-
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects-
dc.titleDevelopment of wafer bonding technology for micro-electro-mechanical systems applicationen_US
dc.typeThesisen_US
dc.contributor.supervisorLi, Guoyuanen_US
dc.contributor.schoolSchool of Materials Science & Engineeringen_US
dc.description.degreeMaster of Engineering (SME)en_US
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