Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5137
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dc.contributor.authorYu, Suzhu.en_US
dc.date.accessioned2008-09-17T10:20:57Z-
dc.date.available2008-09-17T10:20:57Z-
dc.date.copyright2000en_US
dc.date.issued2000-
dc.identifier.urihttp://hdl.handle.net/10356/5137-
dc.description.abstractIn order to improve the thermal properties of polymer at lower filler content, polystyrene (PS) composites filled with aluminum nitride (A1N) have been prepared. The most notable feature of the present work is that a special dispersion state of the filler in the composite has been formed — aluminum nitride filler particles surrounding polystyrene matrix particles. The thermal, dielectric property and dynamic mechanical behavior of polymer composite have been investigated as a function of filler volume content, temperature and particle size of polymer matrix.en_US
dc.format.extent166 p.-
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineering::Materials::Composite materials-
dc.titleComposites for microelectronics applicationsen_US
dc.typeThesisen_US
dc.contributor.supervisorHing, Peteren_US
dc.contributor.schoolSchool of Materials Science & Engineeringen_US
dc.description.degreeMaster of Engineering (MSE)en_US
item.grantfulltextrestricted-
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Appears in Collections:MSE Theses
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