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dc.contributor.authorWong, Jocelin Baoxuan.
dc.description.abstractIn recent years, travel packages are decreasing in popularity in the global tourism market. The emergence of mobile technology and social media platforms has made planning of tour easier for Free and Independent Travellers. However, this causes a drop in customer satisfaction level in tour operators, travel and ticketing agencies. This led to the motivation of this project. The development of ExTravel application aims to enhance travel packages with the idea of gamification to give tourists an all-rounded travel experience which includes pre, during and post activities. ExTravel also targets the different age groups by providing different features. Before the tour, tourists can use ExTravel to view the tour itinerary and the destinations through Google map integration. During the tour, ExTravel allows tourists to stay connected with their friends and families through incorporating Facebook. ExTravel also combines virtual and physical worlds together with augmented reality, providing a memorable and unique travel experience for tourists. After the tour, tourists will be able to reminisce the tour through ExTravel album of polaroid which the tourists captured during the tour. Although ExTravel is developed based on a Singapore travel package, it can also be reused for different travel packages of different countries. By modifying the xml and graphics, ExTravel can be used for other travel packages. Through this application, it is hoped to change the traditional way of packaging travel packages and also to increase consumers in travelling with travel packages.en_US
dc.format.extent45 p.en_US
dc.rightsNanyang Technological University
dc.subjectDRNTU::Engineering::Computer science and engineering::Software::Software engineeringen_US
dc.titleAugmented reality enhancements to travel packagesen_US
dc.typeFinal Year Project (FYP)en_US
dc.contributor.supervisorNg Wee Keongen_US
dc.contributor.schoolSchool of Computer Engineeringen_US
dc.description.degreeBachelor of Engineering (Computer Science)en_US
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Appears in Collections:SCSE Student Reports (FYP/IA/PA/PI)
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