Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/52252
Title: Simulation of thermal behavior of silica glass and silicon with pulse laser heating
Authors: Liu, Mojia.
Keywords: DRNTU::Engineering::Materials::Testing of materials
Issue Date: 2013
Abstract: This project made use of a 3D model to study the thermo behavior of silica glass and silicon material under Continuous wave laser annealing (cw LA). Two simulations were carried out to illustrate different scenarios, including static laser, rotating wafer with moving laser. Simulated results of the temperature distribution within the sample material are demonstrated for both models. Comparisons of temperature distribution under different laser power density were shown. The model is able to measure and predict processing temperature of the sample up to its melting point.
URI: http://hdl.handle.net/10356/52252
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MSE Student Reports (FYP/IA/PA/PI)

Files in This Item:
File Description SizeFormat 
MSESimulation of Thermal Behavior of Silica Glass and Silicon With Pulse Laser Heating.pdf
  Restricted Access
Simulation of Thermal Behavior of Silica Glass and Silicon With Pulse Laser Heating 1.9 MBAdobe PDFView/Open

Page view(s)

296
checked on Sep 23, 2020

Download(s)

18
checked on Sep 23, 2020

Google ScholarTM

Check

Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.