dc.contributor.authorZhang, Hongxiaen_US
dc.date.accessioned2008-09-17T10:47:06Z
dc.date.accessioned2017-07-23T08:38:31Z
dc.date.available2008-09-17T10:47:06Z
dc.date.available2017-07-23T08:38:31Z
dc.date.copyright2007en_US
dc.date.issued2007
dc.identifier.citationZhang, H. (2007). Stress investigation on interacting defects in piezoelectric materials. Doctoral thesis, Nanyang Technological University, Singapore.
dc.identifier.urihttp://hdl.handle.net/10356/5287
dc.description.abstractDislocation emission mechanisms for micro crack initiation are proposed, at the tips of a semi-infinite rigid conducting line for plane case and a finite rigid conducting line for plane and antiplane cases in a piezoelectric medium. The crack is simulated by distributed piezoelectric screw/edge dislocations for antiplane/plane cases. By evaluating mechanical strain energy release rates, connections are obtained between critical rigid line extension forces and critical crack extension forces in the same solid. Two critical crack lengths are observed. Furthermore, the electroelastic interactions are investigated of a screw/edge dislocation and collinear interfacial rigid conducting/dielectric lines in a piezoelectric bimaterial, by using complex variable methods and Stroh formalism. The solutions of the field variables and all kinds of singularities at rigid line tips are obtained. Rigid line extension forces and the image force on the dislocation are calculated. Numerical examples are performed to analyze some important parameters on rigid line extension forces and image forces.en_US
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineering::Mechanical engineering::Mechanics and dynamics
dc.titleStress investigation on interacting defects in piezoelectric materialsen_US
dc.typeThesisen_US
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.contributor.supervisorXiao Zhongminen_US
dc.description.degreeDOCTOR OF PHILOSOPHY (MAE)en_US


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