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https://hdl.handle.net/10356/5303| Title: | Board level bend test and viscoelastic warpage study of IC packages | Authors: | Toh, Siew Khim. | Keywords: | DRNTU::Engineering::Manufacturing | Issue Date: | 2003 | Abstract: | This project aimed to address two main concerns in the production of electronics packages. These include the packages' warpage performance after the assembly processes and board level solder joints' reliability during their service life. | URI: | http://hdl.handle.net/10356/5303 | Schools: | School of Mechanical and Production Engineering | Rights: | Nanyang Technological University | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
| Appears in Collections: | MAE Theses |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| MAE-THESES_1052.pdf Restricted Access | 12.88 MB | Adobe PDF | View/Open |
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