Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/53124
Title: Permanent polymer bonding for MEMS device fabrication and packaging applications
Authors: Lim, Eugene KaiSheng.
Keywords: DRNTU::Engineering::Electrical and electronic engineering::Microelectronics
Issue Date: 2013
Abstract: Permanent wafer bonding with polymers as intermediate adhesive layers plays an important role in fabrication for MEMS systems such as integrated circuits and packaging applications. Polymer adhesive wafer bonding has gained much interest due to its low cost, robust and simple fabrication process. Low temperature bonding has gain importance as elevated temperatures may result in damage to device and affect operation. In this project, low temperature bonding processes using polymers such as Benzocyclobutene (BCB) and Parylene C are presented. Wafers were bonded with both patterned BCB and blanket BCB. Experiment parameters are also presented to achieve an almost void-free bonding with BCB as adhesive layer. Excellent bond quality and strength have also been achieved with BCB with a minimum requirement temperature of 180°C for bonding. BCB bonding are done at 180, 200 and 250°C for 1 hour. Experiment steps for Parylene-to-Silicon patterned bonding are presented with bonding temperatures of 200, 230 and 250°C for 30 minutes. Besides bonding quality, shear strength testing is also conducted and results are presented in the report.
URI: http://hdl.handle.net/10356/53124
Schools: School of Electrical and Electronic Engineering 
Organisations: A*STAR Institute of Microelectronics
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:EEE Student Reports (FYP/IA/PA/PI)

Files in This Item:
File Description SizeFormat 
EB6064-121.pdf
  Restricted Access
3.27 MBAdobe PDFView/Open

Page view(s)

329
Updated on Jun 11, 2024

Download(s)

12
Updated on Jun 11, 2024

Google ScholarTM

Check

Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.