Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/53263
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dc.contributor.authorLim, Wei Wen.
dc.date.accessioned2013-05-31T03:02:39Z
dc.date.available2013-05-31T03:02:39Z
dc.date.copyright2013en_US
dc.date.issued2013
dc.identifier.urihttp://hdl.handle.net/10356/53263
dc.description.abstractThe purpose of this project is to firstly establish a bonding procedure for bonding of PDMS to aluminum surface, secondly to review the bonding procedure for bonding of PDMS to PCTE membrane and finally to design a microfiltration platform with use of acrylic instead of PDMS. Uncured PDMS mixture was used in this project to bond cured PDMS chip to aluminum surface. This was achieved by coating the uncured PDMS on the cured PDMS chip and clamped together with the aluminum plate. Then it was spin in the centrifugal machine to clear the channels of uncured PDMS. Finally the PDMS to aluminum laminate is placed into oven for curing. PDMS to PCTE laminate was fabricated using oxygen plasma and APTES solution. Both PDMS to PCTE laminate and PDMS to aluminum laminate was put underwent pressure testing to determine their interface bonding strength respectively. Results shows that PDMS to PCTE laminate displayed an average maximum pressure of 176kPa and the PDMS to aluminum laminate displayed an average maximum pressure of 242kPa A microfiltration platform was also made with acrylic and the microfiltration platform was put to test with different parameters to determine the factors that will influence the filtration efficiency. Channel depth was found to be one of the factors that influence the filtration efficiency where a smaller channel depth results in better filtration efficiency.en_US
dc.format.extent107 p.en_US
dc.language.isoenen_US
dc.rightsNanyang Technological University
dc.subjectDRNTU::Engineeringen_US
dc.titleMicrofabrication technology for biochipsen_US
dc.typeFinal Year Project (FYP)en_US
dc.contributor.supervisorGong Haiqing, Thomasen_US
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.description.degreeBachelor of Engineering (Mechanical Engineering)en_US
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Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)
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