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|Title:||Application of finite element method to compare die textures in microforming||Authors:||Saraf, Parag.||Keywords:||DRNTU::Engineering::Manufacturing::CAD/CAM systems||Issue Date:||2013||Abstract:||With the increase demands in miniaturized products, microforming has become increasingly popular due to its economic advantages. However, the well-established bulk forming technology cannot be applied to microforming due to size and frictional effects. Friction tends to increase in microforming. Studies suggest that texturing of die surface reduces friction even without the use of lubricants. With this as the primary focus the project aims to simulate the effects on dry friction with texturing of die surfaces using Finite Element Method. It aims to determine the size independent frictional property so that it can be used in higher scale simulation without modeling the texture. Result suggests that the coefficient of friction reduces as the area fraction of the texture increases until an optimum range. This optimal range was found to be in between 20-25% of texture area fraction. The effect of the type of texture plays a crucial role in reducing friction. Ridge textured die with an area fraction of 23.44% reduced friction by 20.12% and has an operating pressure limit of 740MPa, while Pore textured die with an area fraction of 24.63% reduced friction by 16.59% having an operation pressure limit of 546MPa. The accuracy of translating the effects of textured die surface for higher scale simulation was over 99.7%. The approach can be used to optimize die textures replacing the trial and error experimentation that is quite capital intensive. Future recommendations include experimental validation and application of Extended Finite Element Methods (XFEM) to simulate wear particle entrapment.||URI:||http://hdl.handle.net/10356/53313||Schools:||School of Mechanical and Aerospace Engineering||Rights:||Nanyang Technological University||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||MAE Student Reports (FYP/IA/PA/PI)|
Updated on Dec 4, 2023
Updated on Dec 4, 2023
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