Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5340
Title: Characterization of aluminium pad under different process conditions
Authors: Wang, Jian Hua.
Keywords: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
Issue Date: 2004
Abstract: The objective of this study is to improve the aluminum film uniformity by optimizing the process condition. The aluminum film was deposited by a sputtering process on 200mm wafers in AMAT Endura® PVD chambers.
URI: http://hdl.handle.net/10356/5340
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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