Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5365
Title: Ultrasonic characterisation of interfaces in IC packaging
Authors: Wang, Yi
Keywords: DRNTU::Engineering::Manufacturing
Issue Date: 2005
Source: Wang, Y. (2005). Ultrasonic characterisation of interfaces in IC packaging. Doctoral thesis, Nanyang Technological University, Singapore.
Abstract: The study demonstrates that the quantification evaluation of the interface quality is possible, and oblique reflection coefficient can be used as a criterion for its better sensitivity. The result is also applicable to interfaces in other IC packaging configurations since the interface studied in this work is very generic.
URI: https://hdl.handle.net/10356/5365
DOI: 10.32657/10356/5365
Rights: Nanyang Technological University
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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