Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5368
Title: Drop-impact analysis of packaged electronic products containing nonlinear cushion buffers and multilayer circuit boards
Authors: Wang, Yuqi
Keywords: DRNTU::Engineering::Manufacturing::Product engineering
Issue Date: 2008
Source: Wang, Y. (2008). Drop-impact analysis of packaged electronic products containing nonlinear cushion buffers and multilayer circuit boards. Doctoral thesis, Nanyang Technological University, Singapore.
Abstract: Modern electronic products are becoming lighter in weight and smaller in size as well as its increasing functionality. They are often experiencing the severe vibration and shock environment in many applications. Drop/impact tolerance, or the ability to safely withstand accidental drop/impact, is becoming an increasingly important aspect of the reliability of electronic products. And shock analysis and corresponding protection methods are quite meaningful to the development of electronic products. Thus, the objective of this work is to realize quick drop-impact analysis of packaged electronic products.
URI: https://hdl.handle.net/10356/5368
DOI: 10.32657/10356/5368
Rights: Nanyang Technological University
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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