dc.contributor.authorWang, Yuqien_US
dc.date.accessioned2008-09-17T10:49:00Z
dc.date.accessioned2017-07-23T08:38:36Z
dc.date.available2008-09-17T10:49:00Z
dc.date.available2017-07-23T08:38:36Z
dc.date.copyright2008en_US
dc.date.issued2008
dc.identifier.citationWang, Y. (2008). Drop-impact analysis of packaged electronic products containing nonlinear cushion buffers and multilayer circuit boards. Doctoral thesis, Nanyang Technological University, Singapore.
dc.identifier.urihttp://hdl.handle.net/10356/5368
dc.description.abstractModern electronic products are becoming lighter in weight and smaller in size as well as its increasing functionality. They are often experiencing the severe vibration and shock environment in many applications. Drop/impact tolerance, or the ability to safely withstand accidental drop/impact, is becoming an increasingly important aspect of the reliability of electronic products. And shock analysis and corresponding protection methods are quite meaningful to the development of electronic products. Thus, the objective of this work is to realize quick drop-impact analysis of packaged electronic products.en_US
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineering::Manufacturing::Product engineering
dc.titleDrop-impact analysis of packaged electronic products containing nonlinear cushion buffers and multilayer circuit boardsen_US
dc.typeThesisen_US
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.contributor.supervisorLow Kin Huaten_US
dc.description.degreeDOCTOR OF PHILOSOPHY (MAE)en_US


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