Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/53956
Title: Advanced microchip cooling
Authors: Chua, Boon Tarn.
Keywords: DRNTU::Engineering::Mechanical engineering::Fluid mechanics
Issue Date: 2013
Abstract: Microchip was invented in 1958 and has been widely use in the electronic field since then. According to Moore’s law, the number of transistors on a microchip double every 18 month to 2 year, however heat generated is still proportional to the number of transistors. When microchip gets smaller, the density of transistors per unit area increases which also increases the heat generation. Therefore many microchip companies are still facing the heat problem. Given the current technology in the market, spray cooling had been a potential method to the problem. This project will explore how spray cooling technology can be efficiently combined with thermal ground plate so to maximize microchip cooling. The experiment will involve how various type of high conductivity materials coated on the microchip affect the heat dissipation rate, and also be looking at how the spray pressure and the orientation of spray affect the overall cooling effect on the microchip.. This report will show the methods and procedure used to obtain the result and further conclude on microchip cooling problem.
URI: http://hdl.handle.net/10356/53956
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)

Files in This Item:
File Description SizeFormat 
MB420.pdf
  Restricted Access
ADVANCE MICROCHIP COOLING2.57 MBAdobe PDFView/Open

Page view(s)

198
Updated on Apr 19, 2021

Download(s) 50

18
Updated on Apr 19, 2021

Google ScholarTM

Check

Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.