Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/54031
Title: Precision crack-off method for silicon wafering
Authors: Tan, Gary Wei Liang.
Keywords: DRNTU::Engineering
Issue Date: 2013
Abstract: Silicon is widely used in fabricating silicon wafers for electronics which are used in our daily life. However, the current method of using diamond wire-sawing method to fabricate silicon wafer is still too time consuming and produces almost 50% of wastage due to the high kerf loss of the diamond wire. In this project, an alternative process using the precision crack-off method to wafer silicon block was being studied. With a similar study on glass rod (BK-7) which produced promising results using this method, the author venture further to use the precision crack-off method on silicon block. Modifications were done to the design of the experiment setup and new feature was being explored such as implementing notches all around the silicon block to produce a better surface finishing. Through the data collected, this project offers exciting possibilities of using precision crack-off method as an alternative process to slice silicon ingot in its single crystalline structure.
URI: http://hdl.handle.net/10356/54031
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Student Reports (FYP/IA/PA/PI)

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