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https://hdl.handle.net/10356/5419| Title: | Development of compact thermal models for advanced electronic packages | Authors: | Xie, Ming. | Keywords: | DRNTU::Engineering::Manufacturing | Issue Date: | 2002 | Abstract: | This study is aimed at developing compact models for advanced electronic packages, such as an area array e.g. Ball Grid Array (BGA), or flip chip type packages. | URI: | http://hdl.handle.net/10356/5419 | Schools: | School of Mechanical and Production Engineering | Rights: | Nanyang Technological University | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
| Appears in Collections: | MAE Theses |
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| File | Description | Size | Format | |
|---|---|---|---|---|
| MAE-THESES_1157.pdf Restricted Access | 2.42 MB | Adobe PDF | View/Open |
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