Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5419
Title: Development of compact thermal models for advanced electronic packages
Authors: Xie, Ming.
Keywords: DRNTU::Engineering::Manufacturing
Issue Date: 2002
Abstract: This study is aimed at developing compact models for advanced electronic packages, such as an area array e.g. Ball Grid Array (BGA), or flip chip type packages.
URI: http://hdl.handle.net/10356/5419
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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