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https://hdl.handle.net/10356/5419
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DC Field | Value | Language |
---|---|---|
dc.contributor.author | Xie, Ming. | en_US |
dc.date.accessioned | 2008-09-17T10:50:05Z | - |
dc.date.available | 2008-09-17T10:50:05Z | - |
dc.date.copyright | 2002 | en_US |
dc.date.issued | 2002 | - |
dc.identifier.uri | http://hdl.handle.net/10356/5419 | - |
dc.description.abstract | This study is aimed at developing compact models for advanced electronic packages, such as an area array e.g. Ball Grid Array (BGA), or flip chip type packages. | en_US |
dc.rights | Nanyang Technological University | en_US |
dc.subject | DRNTU::Engineering::Manufacturing | - |
dc.title | Development of compact thermal models for advanced electronic packages | en_US |
dc.type | Thesis | en_US |
dc.contributor.supervisor | Toh, Kok Chuan | en_US |
dc.contributor.school | School of Mechanical and Production Engineering | en_US |
dc.description.degree | Master of Engineering (MPE) | en_US |
item.fulltext | With Fulltext | - |
item.grantfulltext | restricted | - |
Appears in Collections: | MAE Theses |
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File | Description | Size | Format | |
---|---|---|---|---|
MAE-THESES_1157.pdf Restricted Access | 2.42 MB | Adobe PDF | View/Open |
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