dc.contributor.authorXiong, Bingshouen_US
dc.date.accessioned2008-09-17T10:50:12Z
dc.date.accessioned2017-07-23T08:38:37Z
dc.date.available2008-09-17T10:50:12Z
dc.date.available2017-07-23T08:38:37Z
dc.date.copyright2005en_US
dc.date.issued2005
dc.identifier.citationXiong, B. S. (2005). Mechanics of materials characterization of lead-free solders. Doctoral thesis, Nanyang Technological University, Singapore.
dc.identifier.urihttp://hdl.handle.net/10356/5423
dc.description.abstractLead-free solders will replace tin-lead solders in electronic products due to European Union laws to restrict the use of toxic materials like lead (Pb) in electronic equipment by July 1st, 2006. Legislation to ban the use of lead (Pb) is forcing the electronic industry to use lead-free solders. Solder interconnections serve as electrical connections and also as the mechanical support to hold the IC component in position on the printed circuit board (PCB). It is important to characterize the mechanical properties of lead-free solders. NEMI (National Electronic Manufacturing Initiative) recommends Sn-3.9Ag-0.6Cu(±0.2%) for reflow soldering process and Sn-0.7Cu solder alloy for wave soldering. The scope of this study includes the two NEMI recommended Pb-free solder alloys, namely Sn-3.8Ag-0.7Cu and Sn-0.7Cu. A mechanics of materials characterization of the elastic-plastic-creep properties and low cycle fatigue behavior is reported. A new visco-plastic constitutive model and fatigue model is presented and used to model the thermal fatigue behavior of a Micro-BGA assembly.en_US
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineering::Manufacturing
dc.titleMechanics of materials characterization of lead-free soldersen_US
dc.typeThesisen_US
dc.contributor.schoolSchool of Mechanical and Aerospace Engineeringen_US
dc.contributor.supervisorPang Hock Lye, Johnen_US
dc.description.degreeDOCTOR OF PHILOSOPHY (MAE)en_US


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