Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5442
Title: Study of solder joints for ball grid array (BGA) assembly
Authors: Yam, Shong Wai
Keywords: DRNTU::Engineering::Manufacturing
Issue Date: 2002
Abstract: This thesis aims to study failure characteristics of solder joints (10Sn/90Pb solder ball and eutetic Sn-Pb solder fillet) in Ceramic Ball Grid Array (CBGA) and assembly, and investigate the effect of Accelerated Thermal Cycling (ATC) and reflow atmosphere on joint failure. Metallographic sections and fracture surfaces of solder joints were examined using optical and Scanning Electron Microscope (SEM).
URI: http://hdl.handle.net/10356/5442
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

Files in This Item:
File Description SizeFormat 
MAE-THESES_1178.pdf
  Restricted Access
12.46 MBAdobe PDFView/Open

Page view(s) 50

303
Updated on Apr 14, 2021

Download(s)

7
Updated on Apr 14, 2021

Google ScholarTM

Check

Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.