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Title: Process development for PECVD equipment
Authors: Yang, Jian Jun
Keywords: DRNTU::Engineering::Manufacturing::Production management
Issue Date: 2003
Abstract: Process for depositing silicon nitride film by using Micro-90011 PECVD system has been developed. The stress test structure simulation, fabrication and system performance improvement have been studied in the project. The studies are carried out stress measurements at a device level by using micromachined structure. The results can be applied for PECVD deposited silicon nitride film for MEMS device design. A typical, applicable circular and rotation structure was successful fabricated.
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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