Please use this identifier to cite or link to this item:
https://hdl.handle.net/10356/5448| Title: | Process development for PECVD equipment | Authors: | Yang, Jian Jun | Keywords: | DRNTU::Engineering::Manufacturing::Production management | Issue Date: | 2003 | Abstract: | Process for depositing silicon nitride film by using Micro-90011 PECVD system has been developed. The stress test structure simulation, fabrication and system performance improvement have been studied in the project. The studies are carried out stress measurements at a device level by using micromachined structure. The results can be applied for PECVD deposited silicon nitride film for MEMS device design. A typical, applicable circular and rotation structure was successful fabricated. | URI: | http://hdl.handle.net/10356/5448 | Schools: | School of Mechanical and Production Engineering | Rights: | Nanyang Technological University | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
| Appears in Collections: | MAE Theses |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| MAE-THESES_1183.pdf Restricted Access | 9.85 MB | Adobe PDF | View/Open |
Page view(s) 50
621
Updated on May 7, 2025
Download(s)
8
Updated on May 7, 2025
Google ScholarTM
Check
Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.