Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5485
Title: Heat dissipation in ball grid array packages
Authors: Ying, Teck Mun.
Keywords: DRNTU::Engineering::Mechanical engineering
Issue Date: 2000
Abstract: This thesis discusses the issue of thermal management in typical Ball Grid Array (BGA) packages. It aims to study the behavior of heat dissipation in a single BGA solder joint as well as multiple solder joints through the use of analytical, numerical and experimental techniques. Important factors that contribute to the heat dissipation of BGA packages are analyzed and discussed. Such factors include geometrical condition, material properties and thermal loading on the BGA package.
URI: http://hdl.handle.net/10356/5485
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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