Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5485
Full metadata record
DC FieldValueLanguage
dc.contributor.authorYing, Teck Mun.en_US
dc.date.accessioned2008-09-17T10:51:45Z-
dc.date.available2008-09-17T10:51:45Z-
dc.date.copyright2000en_US
dc.date.issued2000-
dc.identifier.urihttp://hdl.handle.net/10356/5485-
dc.description.abstractThis thesis discusses the issue of thermal management in typical Ball Grid Array (BGA) packages. It aims to study the behavior of heat dissipation in a single BGA solder joint as well as multiple solder joints through the use of analytical, numerical and experimental techniques. Important factors that contribute to the heat dissipation of BGA packages are analyzed and discussed. Such factors include geometrical condition, material properties and thermal loading on the BGA package.en_US
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineering::Mechanical engineering-
dc.titleHeat dissipation in ball grid array packagesen_US
dc.typeThesisen_US
dc.contributor.supervisorToh, Kok Chuanen_US
dc.contributor.schoolSchool of Mechanical and Production Engineeringen_US
dc.description.degreeMaster of Engineering (MPE)en_US
item.grantfulltextrestricted-
item.fulltextWith Fulltext-
Appears in Collections:MAE Theses
Files in This Item:
File Description SizeFormat 
MAE-THESES_1216.pdf
  Restricted Access		11.63 MBAdobe PDFView/Open

Page view(s) 50

632
Updated on Apr 29, 2025

Download(s)

8
Updated on Apr 29, 2025

Google ScholarTM

Check

Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.