Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5516
Title: Study of mechanism of ultrasonic wire bonding process
Authors: Zhang, Dong
Keywords: DRNTU::Engineering::Manufacturing
Issue Date: 2003
Abstract: In this study, a sensing cum actuating (SCA) technique is developed to study the wire bonding system. The actuating mechanism of a wire bonder is viewed as an SCA device which possesses an unique transduction matrix correlating the electrical input variables of the PZT driver and the mechanical output variables at the tip of the capillary. The transduction matrix is identified experimentally. Thus, the force and velocity at the tip of the capillary is first time obtained from the input voltage and current of the PZT driver.
URI: http://hdl.handle.net/10356/5516
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

Files in This Item:
File Description SizeFormat 
MAE-THESES_1244.pdf
  Restricted Access
17.96 MBAdobe PDFView/Open

Page view(s) 50

390
Updated on Nov 30, 2020

Download(s) 20

10
Updated on Nov 30, 2020

Google ScholarTM

Check

Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.