Please use this identifier to cite or link to this item:
|Title:||Study of mechanism of ultrasonic wire bonding process||Authors:||Zhang, Dong||Keywords:||DRNTU::Engineering::Manufacturing||Issue Date:||2003||Abstract:||In this study, a sensing cum actuating (SCA) technique is developed to study the wire bonding system. The actuating mechanism of a wire bonder is viewed as an SCA device which possesses an unique transduction matrix correlating the electrical input variables of the PZT driver and the mechanical output variables at the tip of the capillary. The transduction matrix is identified experimentally. Thus, the force and velocity at the tip of the capillary is first time obtained from the input voltage and current of the PZT driver.||URI:||http://hdl.handle.net/10356/5516||Rights:||Nanyang Technological University||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||MAE Theses|
Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.