Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5541
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dc.contributor.authorZhang, Yilu.en_US
dc.date.accessioned2008-09-17T10:53:02Z-
dc.date.available2008-09-17T10:53:02Z-
dc.date.copyright2003en_US
dc.date.issued2003-
dc.identifier.urihttp://hdl.handle.net/10356/5541-
dc.description.abstractThis thesis describes the development of an automatic defects' recognition system based on image segmentation and wavelet template. Following the literature review and description of the theory, the "Susan" operator and Variational method have been tested to obtain the edge of images and are compared with the results obtained with classical operators in normal and speckle noise conditions. Then two ways to obtain the size and location of defects are obtained by using blob-coloring to process the map obtained by the Variational method.en_US
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineering::Manufacturing-
dc.titleApplications of automated defects recognition in IC packaging based on ultrasound C-SAM imagesen_US
dc.typeThesisen_US
dc.contributor.supervisorGuo, Ningqunen_US
dc.contributor.schoolSchool of Mechanical and Production Engineeringen_US
dc.description.degreeMaster of Engineering (MPE)en_US
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