Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5546
Title: Fabrication and thermal stress analysis for PZT thin-layered structures
Authors: Zhang, Yun.
Keywords: DRNTU::Engineering::Manufacturing
Issue Date: 2004
Abstract: Multi-layered thin film structures with silicon as substrate are widely used in modern electronic industry as building blocks of micro devices and systems. When multiple thin film layers are deposited or grown on a silicon substrate, residual stresses are inevitably arisen inside the thin films due to thermal mismatch, phase transfer, and chemical reaction, etc. The residual stress induced cracking and damage is always the main concern in design and fabrication process of novel micro-mechanical devices, as these stresses frequently provide the driving force for mechanical and functional failure.
URI: http://hdl.handle.net/10356/5546
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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