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https://hdl.handle.net/10356/5560| Title: | Transient thermal behavior of electronics chips during accidental loss of pumping power | Authors: | Zheng, Yingjun. | Keywords: | DRNTU::Engineering::Mechanical engineering | Issue Date: | 2001 | Abstract: | Both steady state and transient experiments are performed to study the heat transfer characteristics on an array of four in-line simulated, flush-mounted electronics chips in a vertical rectangular channel. | URI: | http://hdl.handle.net/10356/5560 | Schools: | School of Mechanical and Production Engineering | Rights: | Nanyang Technological University | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
| Appears in Collections: | MAE Theses |
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| File | Description | Size | Format | |
|---|---|---|---|---|
| MAE-THESES_1284.pdf Restricted Access | 2.19 MB | Adobe PDF | View/Open |
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