Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5560
Title: Transient thermal behavior of electronics chips during accidental loss of pumping power
Authors: Zheng, Yingjun.
Keywords: DRNTU::Engineering::Mechanical engineering
Issue Date: 2001
Abstract: Both steady state and transient experiments are performed to study the heat transfer characteristics on an array of four in-line simulated, flush-mounted electronics chips in a vertical rectangular channel.
URI: http://hdl.handle.net/10356/5560
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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