Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5633
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dc.contributor.authorChong, Yok Rue.en_US
dc.date.accessioned2008-09-17T10:55:25Z-
dc.date.available2008-09-17T10:55:25Z-
dc.date.copyright2001en_US
dc.date.issued2001-
dc.identifier.urihttp://hdl.handle.net/10356/5633-
dc.description.abstractThis project investigates the influences of the different methods of analysis in implementing thermal cyclic loading on the stress and strain responses in the flip-chip solder joints.en_US
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineering::Manufacturing-
dc.titleFinite element analysis of flip-chip-on-board assembly subjected to thermal cycling loadingen_US
dc.typeThesisen_US
dc.contributor.supervisorPang, John Hock Lyeen_US
dc.contributor.schoolSchool of Mechanical and Production Engineeringen_US
dc.description.degreeMaster of Engineering (MPE)en_US
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