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Title: Finite element analysis of flip-chip-on-board assembly subjected to thermal cycling loading
Authors: Chong, Yok Rue.
Keywords: DRNTU::Engineering::Manufacturing
Issue Date: 2001
Abstract: This project investigates the influences of the different methods of analysis in implementing thermal cyclic loading on the stress and strain responses in the flip-chip solder joints.
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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