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https://hdl.handle.net/10356/5646| Title: | Variable frequency microwave (VFM) curing for PBGA and FSBGA packages | Authors: | Chua, Riwis Ian Ping. | Keywords: | DRNTU::Engineering::Manufacturing | Issue Date: | 2002 | Abstract: | This paper outlines the technology difference between VFM and conventional curing, the benefits of VFM curing and shares some initial experiences with the Plastic Ball Grid Array and ways to improve the VFM process. | URI: | http://hdl.handle.net/10356/5646 | Schools: | School of Mechanical and Production Engineering | Rights: | Nanyang Technological University | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
| Appears in Collections: | MAE Theses |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| MAE-THESES_175.pdf Restricted Access | 5.3 MB | Adobe PDF | View/Open |
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