Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5646
Title: Variable frequency microwave (VFM) curing for PBGA and FSBGA packages
Authors: Chua, Riwis Ian Ping.
Keywords: DRNTU::Engineering::Manufacturing
Issue Date: 2002
Abstract: This paper outlines the technology difference between VFM and conventional curing, the benefits of VFM curing and shares some initial experiences with the Plastic Ball Grid Array and ways to improve the VFM process.
URI: http://hdl.handle.net/10356/5646
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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