Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5673
Title: Ultrasonic evaluation of silicon/adhesive/copper interfaces in IC packages
Authors: Abdul Jaleel B. Shahul Hamid
Keywords: DRNTU::Engineering::Manufacturing
Issue Date: 2001
Abstract: This thesis evaluated the quality of the silicon/die attach/copper leadframe interfaces by using normal incidence ultrasonic waves.
URI: http://hdl.handle.net/10356/5673
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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