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https://hdl.handle.net/10356/5673
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DC Field | Value | Language |
---|---|---|
dc.contributor.author | Abdul Jaleel B. Shahul Hamid | en_US |
dc.date.accessioned | 2008-09-17T10:56:20Z | |
dc.date.available | 2008-09-17T10:56:20Z | |
dc.date.copyright | 2001 | en_US |
dc.date.issued | 2001 | |
dc.identifier.uri | http://hdl.handle.net/10356/5673 | |
dc.description.abstract | This thesis evaluated the quality of the silicon/die attach/copper leadframe interfaces by using normal incidence ultrasonic waves. | en_US |
dc.rights | Nanyang Technological University | en_US |
dc.subject | DRNTU::Engineering::Manufacturing | |
dc.title | Ultrasonic evaluation of silicon/adhesive/copper interfaces in IC packages | en_US |
dc.type | Thesis | en_US |
dc.contributor.supervisor | Guo, Ningqun | en_US |
dc.contributor.school | School of Mechanical and Production Engineering | en_US |
dc.description.degree | Master of Engineering (MPE) | en_US |
item.fulltext | With Fulltext | - |
item.grantfulltext | restricted | - |
Appears in Collections: | MAE Theses |
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File | Description | Size | Format | |
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MAE-THESES_2.pdf Restricted Access | 4.03 MB | Adobe PDF | View/Open |
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