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https://hdl.handle.net/10356/5734| Title: | Wire sweep analysis for 16L SOIC package | Authors: | Gao, Zheng Yu. | Keywords: | DRNTU::Engineering::Manufacturing | Issue Date: | 2002 | Abstract: | In this paper, we will analyses the root cause of wire sweep and using CAE tools to simulate mold flow in the mold chase and optimize mold chase design. Taguchi Methods, DOE is also using to optimize molding process. 16L SOIC is our test vehicle, our target is reduce wire sweep from more than 10% to less than 5%. | URI: | http://hdl.handle.net/10356/5734 | Schools: | School of Mechanical and Production Engineering | Rights: | Nanyang Technological University | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
| Appears in Collections: | MAE Theses |
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| File | Description | Size | Format | |
|---|---|---|---|---|
| MAE-THESES_254.pdf Restricted Access | 4.49 MB | Adobe PDF | View/Open |
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