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https://hdl.handle.net/10356/5734Full metadata record
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Gao, Zheng Yu. | en_US |
| dc.date.accessioned | 2008-09-17T10:57:47Z | - |
| dc.date.available | 2008-09-17T10:57:47Z | - |
| dc.date.copyright | 2002 | en_US |
| dc.date.issued | 2002 | - |
| dc.identifier.uri | http://hdl.handle.net/10356/5734 | - |
| dc.description.abstract | In this paper, we will analyses the root cause of wire sweep and using CAE tools to simulate mold flow in the mold chase and optimize mold chase design. Taguchi Methods, DOE is also using to optimize molding process. 16L SOIC is our test vehicle, our target is reduce wire sweep from more than 10% to less than 5%. | en_US |
| dc.rights | Nanyang Technological University | en_US |
| dc.subject | DRNTU::Engineering::Manufacturing | - |
| dc.title | Wire sweep analysis for 16L SOIC package | en_US |
| dc.type | Thesis | en_US |
| dc.contributor.supervisor | Pang, John Hock Lye | en_US |
| dc.contributor.school | School of Mechanical and Production Engineering | en_US |
| dc.description.degree | Master of Science (Precision Engineering) | en_US |
| item.fulltext | With Fulltext | - |
| item.grantfulltext | restricted | - |
| Appears in Collections: | MAE Theses | |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| MAE-THESES_254.pdf Restricted Access | 4.49 MB | Adobe PDF | View/Open |
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