Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5788
Title: Analyses of steady and unsteady thermal behaviour of simulated electronic chips in a liquid cooled vertical rectangular channel
Authors: Himangshu Bhowmik
Keywords: DRNTU::Engineering::Mechanical engineering::Fluid mechanics
Issue Date: 2005
Source: Himangshu, B. (2005). Analyses of steady and unsteady thermal behaviour of simulated electronic chips in a liquid cooled vertical rectangular channel. Doctoral thesis, Nanyang Technological University, Singapore.
Abstract: Steady-state and transient experiments are performed to study the single-phase heat transfer from four in-line simulated electronic chips in a vertical rectangular channel using water and FC-72 as the working fluids. The steady-state experimental data covers a laminar flow regime with Reynolds number based on channel hydraulic diameter and Reynolds number based on heater length ranging from 0 to 2220 and 0 to 2775 respectively. The heat flux ranges from 0.1 W/cm2 to 2.6 W/cm2 for steady- state mixed and forced convection heat transfer and 0.1 W/cm2 to 0.6 W/cm2 for steady-state natural convection heat transfer.
URI: https://hdl.handle.net/10356/5788
DOI: 10.32657/10356/5788
Rights: Nanyang Technological University
Fulltext Permission: open
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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