Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5853
Title: Modeling and simulation of drop behaviour of multipack products
Authors: Kambhampati Venugopal.
Keywords: DRNTU::Engineering::Manufacturing::Product engineering
Issue Date: 2006
Abstract: In this project, finite element modeling procedure is developed to conduct drop impact simulation on four packaging materials using Ansys (LS Dyna). The corresponding cushioning curves for the materials are obtained in which the package is then designed.
URI: http://hdl.handle.net/10356/5853
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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