Please use this identifier to cite or link to this item:
Title: Modeling and simulation of drop behaviour of multipack products
Authors: Kambhampati Venugopal.
Keywords: DRNTU::Engineering::Manufacturing::Product engineering
Issue Date: 2006
Abstract: In this project, finite element modeling procedure is developed to conduct drop impact simulation on four packaging materials using Ansys (LS Dyna). The corresponding cushioning curves for the materials are obtained in which the package is then designed.
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

Files in This Item:
File Description SizeFormat 
  Restricted Access
16.82 MBAdobe PDFView/Open

Page view(s) 20

checked on Oct 24, 2020

Download(s) 20

checked on Oct 24, 2020

Google ScholarTM


Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.