Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5925
Title: Stress evaluation in thin films
Authors: Lalita Varma P. V. S. N.
Keywords: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
Issue Date: 2001
Abstract: We are in the midst of a major technology transition from alumni to copper as the metallization material. In the present study, a comprehensive examination of the change in the stress state due to this technology transition has been made, which is done by repeating the experiments that were done on aluminium and comparing the results when the same tests were done on copper.
URI: http://hdl.handle.net/10356/5925
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

Files in This Item:
File Description SizeFormat 
MAE-THESES_426.pdf
  Restricted Access
2.15 MBAdobe PDFView/Open

Page view(s)

201
Updated on Dec 1, 2020

Download(s)

3
Updated on Dec 1, 2020

Google ScholarTM

Check

Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.