Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5925
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dc.contributor.authorLalita Varma P. V. S. N.en_US
dc.date.accessioned2008-09-17T11:02:31Z-
dc.date.available2008-09-17T11:02:31Z-
dc.date.copyright2001en_US
dc.date.issued2001-
dc.identifier.urihttp://hdl.handle.net/10356/5925-
dc.description.abstractWe are in the midst of a major technology transition from alumni to copper as the metallization material. In the present study, a comprehensive examination of the change in the stress state due to this technology transition has been made, which is done by repeating the experiments that were done on aluminium and comparing the results when the same tests were done on copper.en_US
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films-
dc.titleStress evaluation in thin filmsen_US
dc.typeThesisen_US
dc.contributor.supervisorRamamurthy, Upadrastaen_US
dc.contributor.schoolSchool of Mechanical and Production Engineeringen_US
dc.description.degreeMaster of Engineering (MPE)en_US
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