Stress evaluation in thin films

Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5925

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DC Field	Value	Language
dc.contributor.author	Lalita Varma P. V. S. N.	en_US
dc.date.accessioned	2008-09-17T11:02:31Z	-
dc.date.available	2008-09-17T11:02:31Z	-
dc.date.copyright	2001	en_US
dc.date.issued	2001	-
dc.identifier.uri	http://hdl.handle.net/10356/5925	-
dc.description.abstract	We are in the midst of a major technology transition from alumni to copper as the metallization material. In the present study, a comprehensive examination of the change in the stress state due to this technology transition has been made, which is done by repeating the experiments that were done on aluminium and comparing the results when the same tests were done on copper.	en_US
dc.rights	Nanyang Technological University	en_US
dc.subject	DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films	-
dc.title	Stress evaluation in thin films	en_US
dc.type	Thesis	en_US
dc.contributor.supervisor	Ramamurthy, Upadrasta	en_US
dc.contributor.school	School of Mechanical and Production Engineering	en_US
dc.description.degree	Master of Engineering (MPE)	en_US
item.fulltext	With Fulltext	-
item.grantfulltext	restricted	-
Appears in Collections:	MAE Theses

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