Please use this identifier to cite or link to this item:
Full metadata record
DC FieldValueLanguage
dc.contributor.authorLalita Varma P. V. S. N.en_US
dc.description.abstractWe are in the midst of a major technology transition from alumni to copper as the metallization material. In the present study, a comprehensive examination of the change in the stress state due to this technology transition has been made, which is done by repeating the experiments that were done on aluminium and comparing the results when the same tests were done on copper.en_US
dc.rightsNanyang Technological Universityen_US
dc.subjectDRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films-
dc.titleStress evaluation in thin filmsen_US
dc.contributor.supervisorRamamurthy, Upadrastaen_US
dc.contributor.schoolSchool of Mechanical and Production Engineeringen_US
dc.description.degreeMaster of Engineering (MPE)en_US
item.fulltextWith Fulltext-
Appears in Collections:MAE Theses
Files in This Item:
File Description SizeFormat 
  Restricted Access
2.15 MBAdobe PDFView/Open

Google ScholarTM


Items in DR-NTU are protected by copyright, with all rights reserved, unless otherwise indicated.