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Title: Stress evaluation in thin films
Authors: Lalita Varma P. V. S. N.
Keywords: DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
Issue Date: 2001
Abstract: We are in the midst of a major technology transition from alumni to copper as the metallization material. In the present study, a comprehensive examination of the change in the stress state due to this technology transition has been made, which is done by repeating the experiments that were done on aluminium and comparing the results when the same tests were done on copper.
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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