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|Title:||Simulation of heat flow in 3D packages with flexible circuits||Authors:||Lee, Teck Soon.||Keywords:||DRNTU::Engineering::Mechanical engineering||Issue Date:||2004||Abstract:||Improvement the thermal management by using the two miniature heat sinks mounted on the two chips. The flexible circuits are folded in a manner that the chips with and without the diamond heat sinks are stacking on each other.||URI:||http://hdl.handle.net/10356/5947||Rights:||Nanyang Technological University||Fulltext Permission:||restricted||Fulltext Availability:||With Fulltext|
|Appears in Collections:||MAE Theses|
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