Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5947
Title: Simulation of heat flow in 3D packages with flexible circuits
Authors: Lee, Teck Soon.
Keywords: DRNTU::Engineering::Mechanical engineering
Issue Date: 2004
Abstract: Improvement the thermal management by using the two miniature heat sinks mounted on the two chips. The flexible circuits are folded in a manner that the chips with and without the diamond heat sinks are stacking on each other.
URI: http://hdl.handle.net/10356/5947
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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