Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/5964
Title: Finite element analysis on overall mechanical properties of molding compounds in electronic packaging
Authors: Leong, Sook Har.
Keywords: DRNTU::Engineering::Materials::Electronic packaging materials
Issue Date: 2000
Abstract: In this thesis, effective elastic moduli of molding compound materials in plastic electronic packages were investigated. The materials are composed of epoxy matrix and silica fillers. Since it is quite difficult to analyze three-dimensional multi-inclusion interaction problems by Finite Element Method (FEM), where as the conclusions of two-dimensional problems are revelatory to three-dimensional problems, composites composed of a matrix and unidirectional aligned fibers or inclusions modeled as two-dimensional plane strain problems, are analyzed by FEM.
URI: http://hdl.handle.net/10356/5964
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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