Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/6027
Title: Effect of moisture on the curing and processing behaviour of an epoxy underfill system
Authors: Lim, Sin Heng.
Keywords: DRNTU::Engineering::Manufacturing
Issue Date: 2000
Abstract: This project sought to evaluate two cases of water contamination on the processing behaviour and the thermo-mechanical properties of an anhydride cured cycloaliphatic epoxy resin commonly used in underfill formulations. In this study, known amounts of water were deliberately introduced into underfill system via two different routes as to simulate two possible ways that water can be introduced to the underfill system, namely (a) during production stage, and (b) during storage and formulation stage. In order to simulate the first case of contamination, water was added directly to the formulated underfill system. As for the second case, water was added directly to the epoxy resin before formulation.
URI: http://hdl.handle.net/10356/6027
Rights: Nanyang Technological University
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:MAE Theses

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