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https://hdl.handle.net/10356/60517| Title: | Ultrasonic bonding of microfluidic devices | Authors: | Tan, Wei Yung | Keywords: | DRNTU::Engineering::Manufacturing | Issue Date: | 2010 | Abstract: | The objective of this study was to find optimal bonding parameters to achieve desirable weld quality in terms of seal appearance and leak-proof sealing with proper microfluidic flow between a micro-mixer and a cover plate. Microfluidic micro-mixer plates with inlets and cover plates were manufactured using SUMIPEX PMMA LG2 by injection moulding. A new and improved fixture for ultrasonic welding was designed and fabricated using Aluminium and Delrin for a comparison between rigid and resilient fixtures. | URI: | http://hdl.handle.net/10356/60517 | Schools: | School of Mechanical and Aerospace Engineering | Research Centres: | Singapore-MIT Alliance Programme | Fulltext Permission: | restricted | Fulltext Availability: | With Fulltext |
| Appears in Collections: | SMA Theses |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| WeiYung2010.pdf Restricted Access | Main Report | 3.17 MB | Adobe PDF | View/Open |
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