Please use this identifier to cite or link to this item: https://hdl.handle.net/10356/60517
Title: Ultrasonic bonding of microfluidic devices
Authors: Tan, Wei Yung
Keywords: DRNTU::Engineering::Manufacturing
Issue Date: 2010
Abstract: The objective of this study was to find optimal bonding parameters to achieve desirable weld quality in terms of seal appearance and leak-proof sealing with proper microfluidic flow between a micro-mixer and a cover plate. Microfluidic micro-mixer plates with inlets and cover plates were manufactured using SUMIPEX PMMA LG2 by injection moulding. A new and improved fixture for ultrasonic welding was designed and fabricated using Aluminium and Delrin for a comparison between rigid and resilient fixtures.
URI: http://hdl.handle.net/10356/60517
Fulltext Permission: restricted
Fulltext Availability: With Fulltext
Appears in Collections:SMA Theses

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